IC Insights (Scottsdale, Ariz.) said the decline in 200-mm and below capacity picked up speed in 2009 and continued through 2011 as suppliers closed or upgraded fabs that were using smaller wafers in order to produce devices more cost-effectively on larger wafers.
Some of the fabs closed by semiconductor manufacturers are being refurbished for production on larger wafers or for production of non-IC products, IC Insights said. In the coming years, more companies are expected to shutter older fabs as they transition to the fab-lite business model or become completely fabless, the firm predicts.
Twenty-one of the 49 fab closures between 2009 and 2011 were 150-mm wafer fabs, according to IC Insights. Thirteen of the closed fabs were 200-mm fabs, seven were 125-mm fabs, three were 100-mm fabs, IC Insights said.
Five of the 49 fab closures were actually 300-mm fabs, IC Insights said. With Qimonda AG going out of business in early 2009, it's 300-mm fabs became the first 300-mm fabs to cease commercial operations, according to the firm.
Report: Chip makers closed 49 fabs in three years
TAG:IC Insights Fab Closures
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