2012-01-23

Samsung’s faster memory uses less power

SAMSUNG has started producing embedded multi-chip package (eMCP) memory with lower power usage but faster chips.

The new eMCP solutions come in a range of densities. They use LPDDR2 (low power double-data-rate 2) DRAM made with 30nm class process technology and NAND flash memory with 20nm class technology.

According to Samsung Electronics, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density.

Samsung Electronics claims the new eMCP memory solutions will help entry- to mid-level smartphones deliver enhanced performance and longer battery life, while providing mobile handset developers with a simpler design process.

The solutions come in packages that consist of a 4GB Embedded MultiMediaCard based on 20nm-class NAND flash memory for data storage, and a choice of 256MB, 512MB or 768MB of 30nm-class LPDDR2 DRAM for supporting high-performance mobile device systems.

The 30nm LPDDR2 DRAM chip in the solution provides a data transmission speed of 1,066 megabits per second, which doubles the performance of the industry's previous mobile DRAM (MDDR). This is also a 30 percent performance increase on the 40nm class LPDDR2 DRAM.


Samsung’s faster memory uses less power

TAG:Consumer electronics SAMSUNG memory

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