2012-02-08

SIA makes public technology roadmap

SAN FRANCISCO--The Semiconductor Industry Association (SIA) has made public its 2011 International Technology Roadmap for Semiconductors (ITRS). , first presented in Incheon, Korea on December 14, 2011. Sponsored by Europe, Japan, Korea, Taiwan, and the United States, the report is overseen by the SIA, the voice of America’s semiconductor manufacturing industry.

Dealing with both near and long-term challenges as well as potential innovations, the roadmap lays out what it sees as the path for semiconductor design and manufacturing through 2026.

The aim in looking so far ahead, said the SIA, is to anticipate technical challenges well in advance, giving the industry and research community time to dedicate resources to overcoming them.

One of those key challenges, said SIA president Brian Toohey, was keeping pace with Moore’s Law, and how to continue decreasing the size of semiconductors while increasing performance standards to meet consumer demands.



SIA makes public technology roadmap

TAG:3d stacking chips semiconductors roadmap

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